Coto’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 Ω environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packag- ing allows relays to be integrated easily on boards designed for surface mount processing.
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